Sapa Extrusions, is the leader in superior design and manufacture of heat sinks for the computer, telecommunications, medical, military and electronics industry.

Standard Heat Sinks
Sapa offers a full range of standard heat sinks with fin ratios up to 6:1. These heat sinks can be used in either a natural or force convection environment. Surface treatment is customizable. 

High Fin Ratio and Thin Fin Heat Sink

Ratio =Area of Gap/(Gap Width)2  
        
Sapa has developed state of the art technology to achieve Standard High Fin Ratio and Thin Fin Heat Sinks up to 16:1. Sapa’s high aspect ratio products provide solutions for designers of high-performance electronics when extra fin surface for heat dissipation is needed, but will not permit an increase in the volume of space available for the heat sink.  Sapa’s breadth of experience provides a more efficient heat sink with higher performance per gram. 

Total system dissipated power levels are increasing with every new design. Our
team of product development engineers works closely with each customer to fully
understand the application, and determine their design goals and restrictions to ensure each heat sink is designed to fit their needs.

Heat sinks are primarily produced in Alloy 6063, as this alloy provides superior thermal and mechanical properties.

Market demands have shifted attention to decreasing the volume and increasing thermal efficiency.  At Sapa, our research engineers are continually investigating and developing new technologies to enhance our capabilities.